PCB Circuit Board Fabrication Assembly OEM olupese SMD/PTH Iṣagbesori Pẹlu PCB & PCBA Iyẹwo ni kikun
PATAKI Ọja:
| Ohun elo ipilẹ: | FR4-TG140 | Ipari Ilẹ: | HASL(Ọfẹ Asiwaju) |
| Sisanra PCB: | 1.6mm | Boju solder: | Dudu |
| Iwọn PCB: | 90*160mm | Iboju siliki: | funfun |
| Iwọn Layer: | 2/L | Cu Sisanra | 35um (1 iwon) |
| Iṣagbesori Iru: | SMT+DIP | Package SMT | 0201,BGA, QFN |
| Iṣẹ Idanwo | AOI, X-Ray, Idanwo Iṣẹ | Iru olupese | Apejọ factory |
TurnkeyAwọn iṣẹ:
1. PCB iṣelọpọ
2. Turnkey PCBA: PCB + paati + SMT ati nipasẹ-iho ijọ + apade igbáti&ile
Ọja akọkọ:
Anfani wa:
1, Programming atiFunctional igbeyewo
2, IPC-A-610E boṣewa, E-igbeyewo, X-ray, AOI igbeyewo, QC, 100% functional igbeyewo.
3, Ọjọgbọn iṣẹ.ISO SMT ati nipasẹ apejọ iho, diẹ sii ju iriri ọdun 10 lọ.
4,Ijẹrisi: 94v-0, CE, SGS, FCC, RoHS, ISO9001:2008, ISO14001
5,Akoko atilẹyin ọja fun PCBA: 2 ọdun.
AGBARA SISE PCBA:
| Turnkey PCBA | PCB + paati Alagbase + apejọ + akopọ |
| Awọn alaye apejọ | SMT ati Thru-iho, PCB apade ijọ |
| Akoko asiwaju | Afọwọṣe:10-12ṣiṣẹingawọn ọjọ.Ibere ọpọ:18~20wowoọbaawọn ọjọ |
| Idanwo lori awọn ọja | Idanwo Iwadi Flying,Idanwo E-,Ayẹwo X-ray, Idanwo AOI, Idanwo iṣẹ-ṣiṣe |
| Opoiye | Iwọn min: 1pcs.Afọwọkọ, aṣẹ kekere, aṣẹ pupọ |
| Awọn failiiru | PCB: Awọn faili Gerber (CAM, PCB, PCBDOC) |
| Awọn paati: Iwe-owo Awọn ohun elo (Atokọ BOM) | |
| Apejọ: Yan&Gbe faili, Apejọ iyaworan | |
| PCB Panel Iwon | Iwọn min: 0.25*0.25 inches(6*6mm) |
| Iwọn to pọju: 20*20 inches(500*500mm) | |
| PCB Solder Iru | Omi Solder Solder Lẹẹ, RoHS asiwaju free |
| Awọn alaye irinše | Palolo Isalẹ si 01005iwọn |
| BGA atiQFN Fun Chip | |
| Meji-apa SMT Apejọ | |
| Fine ipolowo to 0.8mils | |
| Apá Yiyọ ati Rirọpo | |
| Apopọ paati | Teepu Ge, Tube, Reels, Awọn ẹya alaimuṣinṣin |
AGBARA SISE PCB:
| 1 | Fẹlẹfẹlẹ | 1-32Layer |
| 2 | Board ohun elo iru | FR4,CEramic sobusitireti igbimọ,aluminiomu orisun ọkọ, ga-Tg, Rogers ati siwaju sii |
| 3 | Apapo ohun elo lamination | 4 si 6 awọn ipele |
| 4 | Iwọn to pọju | 600 x1200mm |
| 5 | Board sisanra agbegbe | 0.2 to 6.00mm |
| 6 | Iwọn ila to kere julọ | 3 mil |
| 7 | Aaye laini to kere julọ | 3 mil |
| 8 | Lode Layer Ejò sisanra | 8.75 si 175µm |
| 9 | Ti abẹnu Layer Ejò sisanra | 17.5 si 175µm |
| 10 | Iwọn iho liluho (lilu ẹrọ) | 0.25 to 6.00mm |
| 11 | Ila opin iho ti o pari (lilu ẹrọ) | 0.20 to 6.00mm |
| 12 | Ifarada iwọn ila opin iho (lilu ẹrọ) | 0.05mm |
| 13 | Ifarada ipo iho (lilu ẹrọ) | 0.075mm |
| 14 | Lesa lu iho iwọn | 0.10mm |
| 15 | Board sisanra ati Iho opin ratio | 10:1 |
| 16 | Solder boju iru | Alawọ ewe, Yellow, Dudu, eleyi ti, Blue, Funfun ati Pupa |
| 17 | Kere solder boju | Ø0.10mm |
| 18 | Kere iwọn ti solder boju Iyapa oruka | 0.05mm |
| 19 | Solder boju epo plug iho opin | 0,25 to 0.60mm |
| 20 | Ifarada iṣakoso impedance | ± 10% |
| 21 | Ipari dada | HASL(Ọfẹ Asiwaju), ENIG, fadaka immersion, goolu plating, immersion Tin ati goolu ika |
Ifijiṣẹ Yara:
PCBIn Awọn wakati 12
PCBA Ni 3days
Ohun elo Awọn ọja akọkọ:
* Awọn ọja iṣoogun
* Oko Awọn ọja
* Awọn ọja ile-iṣẹ
* Awọn ọja Ibaraẹnisọrọ (Awọn ẹrọ AVL/GPS/GSM)
* Electronics onibara.
Awọn ilana Apejọ PCB:
* Isakoso eto
Awọn faili PCB → DCC → Eto Eto → Imudara → Ṣiṣayẹwo
* SMT Management
Agberu PCB → Atẹwe iboju → Ṣiṣayẹwo → Ipo SMD → Ṣiṣayẹwo → Atunwo afẹfẹ → Ayewo Iran → AOI → Ntọju
* PCBA Management
THT → Soldering Wave (Afọwọṣe Alurinmorin) → Ayewo Iran → ICT → Filaṣi → FCT → Ṣiṣayẹwo → Package → Gbigbe
PHILIFAST n fun ọ ni iṣelọpọ PCB ti o dara julọ ati iriri apejọ
